After stating that externally the "IPhone 6s" should be identical to the iPhone 6 and bring information about an LTE chip twice as fast, the 9to5Mac today published more possible details about the new device this time focused on internal components.
Here's what they learned:
- There is a new NFC processor on the device's logic board. The iPhone 6 uses the 65X10 model from NXP, while the new one uses the 66VP2. THE 9to5Mac speculates that the new version may have a Secure Element built-in, since the one used in the iPhone 6 was launched in 2012.
- The number of chips present in the supposed new logic board is quite low. In one part of it, for example, 10 components have now been concentrated on just 3 chips. This gives more internal space for the battery and also contributes to a lower energy consumption by the components.
- In the alleged prototype analyzed, a Toshiba memory chip with only 16GB was found. It is possible that it will only be used in the development phase and that we will finally move to a minimum of 32GB of capacity in the new generation, but the chance that Apple will keep the 16GB of input even more with iOS 9 coming full of optimizations is not ruled out. in the use of space [1, 2].
- Supposed “iPhone 6s” designs obtained by 9to5Mac with a case manufacturer, they corroborate the idea that externally the device remains the same, but open doors for small and practically imperceptible changes in dimensions. It may, for example, be 0.13mm thicker than the current one as pointed out by a rumor related to the incorporation of Force Touch technology. Even so, a good part of the accessories that exist today should continue to be compatible with the new generation.
None of this is 100% certain, but the history of the sources is very good. Apparently, Apple continues to struggle to control much of its “secrets”