The union makes the force, right? Right: Intel announced last week that, in partnership with Micron, it was able to produce NAND flash memory chips with double the regular capacity. In other words, with a planar structure cell technology it was possible to shove 128Gb (the equivalent of 16GB) of memory into a single silicon biscuit.
This opens the door to the emergence of smartphones and tablets with much more capacity (ol, 128GB iPad!), As well as a good cheapness of SSDs. Additionally, it is worth mentioning that the new techniques used in the production of these super-dense chips also help to reduce the “leakage” of electricity in order to allow the continuous miniaturization of these components.
The first batches of 128GB chips (with eight slices of 16GB stacked) are expected to be ready in January, but mass production should only be in full swing by the middle of next year.
(tip from Gabriel Ferreira; via Electronist)
